INDRBT / Reading room
Final electronics review
Digital engineering model. Payload and repeatability are design targets. All ordinary guide reading, figures and PDFs work here. Links marked Source file lead to the public engineering repository.
Retained digital evidence · results/validation/final_electronics_review.json · SHA-256 d283f65f7b569af698681ecc6a5f1e45efbba0a3a37f921fc1f7a7abb94837ae
This readable record comes from the engineering project. Its assumptions, sampling and rule scope remain part of the result.
{
"status": "PASS",
"scope": "Saved native KiCad evidence plus an independent file/content audit for the low-voltage external-drive interface. This script does not run fresh native checks or certify a physical product.",
"native_kicad_version": "10.0.6",
"native_erc_violations": 0,
"native_drc_errors": 0,
"native_drc_warnings": 0,
"native_unconnected_items": 0,
"native_schematic_parity_issues": 0,
"native_pcb_commands_reviewed": 13,
"native_pcb_command_exit_codes": [
0,
0,
0,
0,
0,
0,
0,
0,
0,
0,
0,
0,
0
],
"component_count": 44,
"connected_nets": 28,
"physical_pad_nets_checked_including_nc": 119,
"stock_footprints": 43,
"local_manufacturer_footprints": 1,
"fuse_correction": {
"status": "PASS",
"manufacturer_part_number": "MF-NSMF025X-2",
"footprint": "INDRBT_Interface:PTC_Bourns_MF-NSMF025X_1206",
"actual_pad_size_mm": [
1.0,
1.6
],
"actual_inner_pad_gap_mm": 2.0,
"actual_pad_centres_mm": [
[
-1.5,
0.0
],
[
1.5,
0.0
]
],
"library_and_board_dimensions_agree": true,
"courtyard_covers_maximum_body_and_pads": true,
"source": "https://www.bourns.com/docs/product-datasheets/mf-nsmf.pdf",
"drawing_page_one_based": 8,
"scope": "Selected digital-design part and manufacturer nominal copper land pattern. No measured trip, inrush, solder-process, temperature, sourcing or production qualification. No manufacturer-specific 3D body model is supplied."
},
"footprint_wildcard_matches": 44,
"bom_values_and_footprints_match_native_design": true,
"assembly_position_count": 41,
"assembly_exclusions": {
"R14": "DNP optional bias",
"R15": "DNP optional bias",
"JP1": "bare copper solder jumper, no body",
"H1-H4": "board-only mechanical holes"
},
"gerber_layer_functions": [
"Copper,L1,Top",
"Copper,L2,Inr",
"Copper,L3,Inr",
"Copper,L4,Bot",
"Legend,Bot",
"Legend,Top",
"Profile",
"SolderMask,Bot",
"SolderMask,Top",
"SolderPaste,Top"
],
"drill_counts": {
"joint_interface-PTH.drl": 68,
"joint_interface-NPTH.drl": 4
},
"ipc_d356_testpoint_count": 151,
"fabrication_zip_entries_checked": 19,
"file_hashes_recomputed": {
"source": 12,
"fabrication": 19,
"review_exports": 8
},
"file_hash_mismatches": 0,
"board_sha256": "1046bd78d82cd37f4eb656b654840edead73e625d1d94488c067a607fa495aba",
"pcb_verification_sha256": "2f4763645c1bc934e1e92fa58b5a4877024c85e5b88b1a8abf9d13b2fbcdc792",
"component_guide": "docs/electronics_components.md",
"component_guide_sha256": "4013c4937ad751a026072f841d3369796dbf5791c9c51e1186981eb113049d18",
"power_calculations": {
"status": "CALCULATED",
"no_measurements": true,
"limit_closed_v": 0.3,
"limit_release_tau_s": 0.001,
"limit_closure_tau_s": 9.09090909090909e-05,
"encoder_nominal_tau_s": {
"A": 1.0000000000000001e-07,
"B": 1.0000000000000001e-07,
"Z": 1.0000000000000001e-07
},
"optional_rs485_bias_nominal_v_two_terminators": 0.275,
"optional_rs485_bias_worst_v_1pct_resistors_3v_supply": 0.24545454545454543,
"optional_rs485_bias_idle_current_a": 0.004583333333333333,
"optional_bias_threshold_check": "PASS; ideal DC network, excludes leakage/cable effects",
"ldo_conservative_dissipation_bound_w": 0.29292,
"ldo_load_path_dissipation_bound_w": 0.29250000000000004,
"ldo_quiescent_power_allowance_w": 0.00042,
"ldo_conditional_junction_estimate_c": 93.89728,
"selected_fuse": "MF-NSMF025X-2",
"selected_fuse_hold_current_at_40c_a": 0.23,
"fuse_input_current_budget_including_ldo_iq_a": 0.15008,
"fuse_hold_current_margin_at_40c_a": 0.07992000000000002,
"fuse_resistance_drop_check_v": 0.34518399999999994,
"fuse_resistance_power_check_w": 0.05180521471999999,
"conditional_ldo_input_at_low_source_v": 3.9048160000000003,
"power_path_claim_boundary": "Conditional calculation using post-reflow 23 C fuse resistance and 25 C diode drop limit. It does not bound cold/hot resistance, diode drop, startup inrush or measured regulation over temperature.",
"thermal_claim_boundary": "Conditional estimate using nominal output, configured load and datasheet reference IQ/theta_ja. Input fuse/diode drops are neglected and regulator quiescent power is included. This is not a full temperature/tolerance bound; PCB copper/airflow and temperature are unverified.",
"pcb_status": "ROUTED PCB; actual DRC/parity/export evidence is recorded separately in pcb_verification.json"
},
"factory_disabled_erc_checks": [
"single_global_label",
"four_way_junction",
"simulation_model_issue",
"footprint_filter"
],
"factory_disabled_drc_checks": [
"missing_courtyard",
"track_not_centered_on_via",
"tuning_profile_track_geometries",
"footprint_filters_mismatch",
"footprint_type_mismatch"
],
"custom_rule_severity_overrides": {},
"drc_exclusions": [],
"remaining_physical_review": [
"Generic stock land patterns are package-compatible design selections, not a complete manufacturer soldering-process approval",
"Passive/LED/connector purchasing codes and effective capacitance under DC bias",
"Controller and encoder currents within the shared 150 mA budget, including terminated-bus loading",
"Fuse trip/inrush and cold/hot voltage-drop behaviour",
"Measured thermal, EMC, ESD, timing, cable grounding/isolation and safety qualification"
],
"references": {
"fuse": "https://www.bourns.com/docs/product-datasheets/mf-nsmf.pdf",
"regulator": "https://www.diodes.com/assets/Datasheets/AP2112.pdf",
"reverse_polarity_diode": "https://www.vishay.com/docs/88746/ss12.pdf",
"input_clamps": "https://assets.nexperia.com/documents/data-sheet/BAT54H.pdf",
"rs485_transceiver": "https://www.analog.com/media/en/technical-documentation/data-sheets/285012fe.pdf"
}
}